Diffusion bonding apparatus for pipes
US6098866A · kind A · utility
22Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1998 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Mar 31, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A diffusion bonding apparatus for pipes that are supplied downward from above comprising a lower block for holding a lower pipe and an upper block for holding and pressing an upper pipe against the lower pipe. In the apparatus, three or more hydrraulic cylinders are provided in a lifting member of the upper block about a joint where the upper pipe is held in such manner that the cylinders are located in a circumference of a circle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.