Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
US6099678A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1997 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Jun 25, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A laminating method and a machine are provided for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip. A leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position b by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.