Polishing material and method of polishing a surface
US6099954A · kind A · utility
29Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1999 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Jun 8, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249986
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polishing pad for polishing hard surfaces such as glass and silicon wafers and a method of polishing using such a polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.