Method of manufacturing a tape carrier with bump
US6100112A · kind A · utility
25Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1998 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Oct 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0394
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bump-attached tape carrier for mounting a semiconductor chip on a circuit substrate, the bump-attached tape carrier comprising, an insulating film, a conductor pattern formed on the insulating film, and metal bumps formed on the conductor pattern and adapted to be bonded with the semiconductor chip, wherein the metal bumps are respectively formed of a columnar body having a side wall substantially perpendicular to the conductor pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.