Softener-free polyamide and molding composition and use thereof
US6100370A · kind A · utility
2Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1999 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | May 6, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G69/44
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention concerns a softener-free polyamide prepared by polycondensation and/or polymerization of polyamide-forming monomers, wherein it was obtained by adding 5-50 wt. % of a dimer diol with a molecular weight within the range of 400-1000 and/or corresponding OH-terminated polyesters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.