Semiconductor device containing semiconductor element in package
US6100583A · kind A · utility
6Cited by
11References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 24, 1999 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Feb 24, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
Abstract
A semiconductor element such as a CCD chip is contained in a recess portion of an opaque package made of plastic, and the upper surface thereof is covered with a transparent cap made of plastic. The cap has a different thermal expansion coefficient from that of the package and is formed in a thickness of 0.5 mm which is thinner than that of the prior art. The semiconductor element is connected with leads and these leads project outside the package. This semiconductor device is mounted to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.