Connectorized substrate and method of connectorizing a substrate
US6100596A · kind A · utility
5Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1996 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Mar 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connectorized substrate and method of connectorizing a substrate is provided, including a substrate having conductive traces mounted thereon and solder paste connected to the conductive traces and conductive spheres mounted to the solder paste. The connectorized substrate of the present invention may be used to provide for components to be added to a motherboard such as a resistor network by mounting resistors to the conductive traces of the substrate such as thick-film ceramic resistors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.