Semiconductor device and method for manufacturing the same
US6100597A · kind A · utility
20Cited by
6References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a face-down mount type of semiconductor device and a method of manufacturing the same, an external connection pad (6) of a circuit board (2) and a conductive bump (3) of a semiconductor chip (1) are coupled to each other, and thermoplastic resin (7) and curable resin (5) are filled into a gap (11) between the semiconductor chip (1) and the circuit board (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.