Thin-film switching elements for electronic devices and a method of manufacturing the same
US6100951A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1997 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Aug 12, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/957
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Thin-film switching elements (20,21) of a display device or the like include a first electrode (22,23) on a substrate (11) and a layer of switching material (24,25) on the first electrode. These switching elements may be semiconductor PIN or Schottky diodes, or MIMs, or TFTs. The switching material is typically .alpha.-Si:H in the case of the semiconductor diodes and TFTs, and tantalum oxide or silicon nitride in the case of the MIMs. An auxiliary layer (28,29) of insulating material is provided between the first electrode (22,23) and the layer of switching material (24,25), leaving an edge (30,31) of the first electrode uncovered, so that the layer of switching material is connected to this edge only. The switching elements with this construction can be patterned using an inexpensive proximity printer, and have a low capacitance value, so counter-acting kickback and crosstalk which can occur in a switching matrix, e.g in the display of television pictures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.