Printed circuit board with integrated cooling mechanism
US6101094A · kind A · utility
17Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1998 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Dec 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10477
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device having two or more printed circuit boards with integrated heat-dissipating mechanism without a fan. A heat-generating circuit component is placed on a daughter board separated from a motherboard. An electrically insulating thermal conductor is placed between the daughter board and the motherboard for heat transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.