Power conversion system having multi-chip packages
US6101114A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1999 |
| Grant date | Aug 8, 2000 |
| Priority date | — |
| Expiry date | Jul 12, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M7/003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A power conversion system that is capable of achieving low inductance, improving cooling performance and making the external shape of the entire system small, is achieved by combining a plurality of single phase inverter units. The inverter units include four device packages each of which is composed of four packaged power devices, two neutral point clamp diodes, two by-pass diode packages and clamp diode packages. Each by-pass diode packages is composed of two packaged by-pass diodes. The clamp diode packages are composed of packaged clamp diodes. The by-pass diode packages are provided on one of the wall surfaces of the clamp diode package, and the device packages are provided on an outside wall surface of the by-pass diode package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.