Patent · US Expired

Laser-diode device including heat-conducting walls, semiconductor strips and isolating seals and process for making laser-diode device

US6101206A · kind A · utility

12Cited by
3References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 27, 1998
Grant dateAug 8, 2000
Priority date
Expiry dateMay 27, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/02423
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Laser device with semiconducting diodes. The invention concerns a device with semiconducting laser diodes comprising individual wafers (8), made of a good heat-conducting material, assembled parallel to one another with semiconducting diode connector bars (9) placed between them as braces, said connector bars only taking up a longitudinal portion of the spaces between the wafers, in which they are located, and the longitudinal portions (17) of said spaces between the wafers, not taken up by said semiconducting connector bars, being used as flow channels for a cooling fluid.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.