High density electrical connector and method of manufacturing the same
US6102748A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1999 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Oct 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high-density electrical connector comprises a housing, two sets of SMT contacts insert molded in opposite sides of the housing, and a shield covering the housing. The housing comprises a first housing member and a second housing member surroundingly incorporating the first housing member. A recess is defined between the first and second housing members. A method of manufacturing the high-density connector comprises the steps of: 1) insert molding a pair of SMT contact carriers to opposite sides of the first housing member; 2) insert molding the first housing member having the two SMT contact carriers to the second housing member; 3) severing carrier plates from the two SMT contact carriers; 4) assembling the shield to the housing. The first insert molding forms a base and a crossbeam retaining mounting and mating portions of the SMT contacts with a gap defined therebetween. The base defines a plurality of openings. The second insert molding fills the openings and the gap to incorporate the base and the crossbeam to form the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.