Fine wire of gold alloy, method for manufacture thereof and use thereof

US6103025A · kind A · utility

Assignee

• W.C. Heraeus GmbH & Co. KG · DE

Inventors

• Gunther Herklotz · Bruchköbel, DE
• Jurgen Reuel · Gelnhausen, DE
• Lutz Schrapler · Alzenau, DE
• Christoph Simons · Trochtelfingen, DE

Key dates

• Filing date: Jul 6, 1998
• Grant date: Aug 15, 2000
• Expiry date: Jul 6, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Fine wires of a gold alloy of 0.05 to 0.95 wt % platinum, palladium or a mixture thereof; 0.001 to 0.1 wt % mischmetal containing at least 50 wt. % of cerium; and 0 to 0.1 wt % of alkaline earth metal. The wire has a favorable strength-to-elongation ratio and is suitable both for wire bonding and for making the ball bumps of flip chips.