System and method for thermally manipulating a combination of a top and bottom substrate before a curing operation
US6103039A · kind A · utility
7Cited by
21References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1998 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | May 19, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1046
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and method cures a combination of a top and a bottom substrate with a resin disposed in-between. A cure device inherently warps the combination in one direction as a result of a curing operation that the cure device performs on the combination. A temperature gradient inducing device is disposed closer to one of the top and bottom substrates to create a temperature gradient between the top and bottom substrate and thereby warp the combination in a direction opposite to the one direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.