Multi-layer laminate and method of producing same
US6103135A · kind A · utility
9Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 1999 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Mar 26, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a multi-layer laminate from a plurality of individual laminates comprised of copper clad on a polyimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.