Ceramic circuit substrate and method of fabricating the same
US6103354A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1997 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Sep 22, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ceramic circuit substrate includes an insulating layer fabricated of a ceramic, a first surface conductor layer fabricated on a surface of the insulating layer and embedded in the insulating layer except at least its surface, and a second surface conductor layer fabricated to be stacked on the first surface conductor layer. A method of fabricating the ceramic circuit substrate includes the steps of printing a first surface conductor layer on a surface of a ceramic green sheet forming an insulating layer, laminating the green sheet and another green sheet on which an inner conductor layer is printed, and co-firing the green sheets, thereby fabricating the first surface conductor layer on a surface of a multilayer substrate, and printing a second surface conductor layer on the first surface conductor layer so that the second surface conductor layer is stacked on the first surface conductor layer and firing the second surface conductor layer, thereby fabricating the two stacked surface conductor layers on the surface of the multilayer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.