Tungsten-copper composite powder
US6103392A · kind A · utility
12Cited by
9References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1995 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Nov 17, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2993
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A high performance W--Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.