Microwave curable adhesive
US6103812A · kind A · utility
17Cited by
43References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1997 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Nov 6, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2809
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a microwave curable adhesive comprising a polymer composition (e.g., a thermoplastic or thermoset polymer) and first and second microwave susceptible components. The first and second microwave susceptible components have a respective preselected size, preselected shape or preselected conductivity or combination thereof. These properties are selected to provide a multi-modal distribution of first and second microwave susceptible components and to increase microwave adsorption within said polymer composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.