Resin composition and heat-resistant, returnable IC tray obtained by molding the same
US6103818A · kind A · utility
5Cited by
6References
2Claims
0Family size
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Key dates
| Filing date | Aug 7, 1998 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | Aug 7, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L79/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition containing components (A), (B), (C) and (D) wherein component (A) is a resin composition containing a thermoplastic polyimide resin, component (B) is carbon fiber, component (C) is mica, component (D) is an internal mold-releasing agent, and relative to 100 parts by weight of component (A), component (B) is from 1 to 80 parts by weight, component (C) 1 to 100 parts by weight, and component (D) is 0.1 to 50 parts by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.