Test apparatus for electronic components
US6104203A · kind A · utility
59Cited by
7References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 1996 |
| Grant date | Aug 15, 2000 |
| Priority date | — |
| Expiry date | May 16, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2849
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test apparatus (1) has a temperature controlled chuck (8) which provides good mechanical stability across a wide temperature range. This significantly reduces the number of times the probes (9) must be re-positioned, and in some cases eliminates such re-positioning. The chuck (8) has a support plate (20) which is connected to a base plate (35) by pillars (40) which have a low thermal expansion coefficient. This limits thermal expansion between the support plate (20) and the base plate (35). In addition, the heat transfer means is mounted so that thermal expansion is accommodated internally.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.