Patent · US Expired

Semiconductor component assembly

US6104615A · kind A · utility

3Cited by

7References

5Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Jens Pohl · San Luis Obispo, US
Simon Muff · Mering, DE
Michael Schneider · Dresden, DE

Key dates

Filing date	Sep 16, 1998
Grant date	Aug 15, 2000
Priority date	—
Expiry date	Sep 16, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A VSMP semiconductor component is mounted by inserting an auxiliary element into a slot in a receptacle. The auxiliary element projects laterally from a narrow side of the semiconductor component and, as the auxiliary element is inserted into the slot, the semiconductor component is properly positioning on the printed circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.