Optical sub-assembly package mount
US6106161A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1998 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Sep 15, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4248
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Compliant, resilient mounting means are provided for minimizing stress on the platform of an optical sub-assembly package caused by temperature change and the like so as to maintain good alignment between the laser beam emitted from a laser chip mounted on the platform and the lens of an optical fiber also mounted on the platform. The resilient means comprise resilient solder bumps of the order of 625 microns thick interposed between the platform and the base to provide a resilient connection between the platform and the base, thereby maintaining good alignment between the laser beam and the lens by reducing the stresses on the optical sub-assembly platform that tend to be caused by temperature changes or the mounting of the package to a rigid, external platform, as by bolting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.