System and method for dispensing a resin between substrates of a bonded storage disk
US6106657A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1998 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | May 19, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and method dispense resin between substrates. A top substrate device holds a top substrate concave up. A bottom substrate device holds a bottom substrate concave down. A resin dispensing device has a needle and dispenses a trajectory of resin defined by an arc having a tangent that touches a tangent of a concave-up-shaped top substrate. The top substrate device may be arranged to include a dampening mechanism to cause a dampened release of the top substrate. Moreover, the top substrate device may be arranged to hold a top substrate so that the top substrate has a continuous concave-up shape extending from a center portion of the top substrate to its outer diameter, and the bottom substrate device may be arranged to hold a bottom substrate so that the bottom substrate has a continuous concave-down shape extending from a center portion of the bottom substrate to its outer diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.