High solids conductive coatings compositions suitable for electrostatic atomization application methods
US6106742A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1999 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Apr 9, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This invention pertains to novel higher solids conductive coating compositions which can be applied by spray and other atomization methods. More particularly, it pertains to novel higher solids conductive coating compositions capable of application by electrostatic atomization methods. While there are many applications in which conductive coatings are useful, the invention is particularly useful for the manufacture of adhesion promoting primer compositions which have higher solids and can be applied by electrostatic atomization methods. The key components of the present invention are: PA1 (i) a conductive pigment, PA1 (ii) a non-conductive polymeric binder, and PA1 (iii) a solvent selected for its ability: PA2 (a) to form a stable non-conductive dispersion of a conductive pigment when subjected to an electrostatic potential of 20000+ volts, PA2 (b) to provide for a higher solids liquid coatings composition thereby reducing the volatile organic emissions (VOC) during application. PA2 (c) to promote the coalescence and formation of a uniform conductive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.