Method of making polishing pads
US6106754A · kind A · utility
19Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1997 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Mar 10, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C43/203
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad having a substantially uniform, continuously interconnected porous surface. The pad can be produced by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer. The sintering process is conducted in a mold at a pressure in excess of 100 psi (0.07 MPa). In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower melting point than the other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.