Method for surface treatment of copper or copper alloys
US6106899A · kind A · utility
11Cited by
10References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1998 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Jul 16, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/389
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for bonding a resin which has a high glass transition temperature but low affinity to copper surfaces with a copper surface with sufficient adhesive strength. The method comprises coating the copper surfaces with an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative, or an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative and at least 0.1% of aminotriazole or an aminotriazole derivative.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.