Bonded structure with high-conductivity bonding element
US6107216A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 1997 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Dec 12, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/188
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A structure (20) is formed of a first article (22) such as a cold finger (82), a second article (24) such as an electronic component (78) to be affixed to and cooled by the cold finger (82), and a bonding element (26) disposed between and bonding together the first article (22) and the second article (24). The bonding element (26) includes a porous metallic body (28), such as a screen, a mesh, a felt, or a foam, and a mass of resin adhesive (36) impregnated into the metallic body (28). The mass of adhesive (36) contacts and bonds to the first article (22) and to the second article (24), and the porous metallic body (28) forms a substantially continuous, high-conductivity path between the first article (22) and the second article (24).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.