Dielectric compositions and method for their manufacture
US6107357A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1999 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Nov 16, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2383/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A novel dielectric composition is provided that is useful in the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by crosslinking a thermally decomposable porogen to a host polymer via a coupling agent, followed by heating to a temperature suitable to decompose the porogen. The porous materials that result have dielectric constants less than about 3.0, with some materials having dielectric constants less than about 2.5. Integrated circuit devices, integrated circuit packaging devices, and methods of manufacture are provided as well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.