Semiconductor thermal protection arrangement
US6108206A · kind A · utility
33Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1999 |
| Grant date | Aug 22, 2000 |
| Priority date | — |
| Expiry date | Jun 21, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling assembly for semiconductor devices in the form of an enclosure including an inlet and outlet with a semiconductor support assembly is presented. The air passage connection with the inlet defines vortex configuration for the rapid transport of compressed air to the semiconductor devices arranged between the enclosure inlet and outlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.