Intaglio printing method, intaglio printer, method of formation of bumps or wiring pattern, apparatus therefor, bump electrode and printed circuit board
US6109175A · kind A · utility
34Cited by
8References
94Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 20, 1998 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Feb 20, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An intaglio printing method and an intaglio printer are proposed, which are suitable for forming a wiring pattern and/or bumps such as bump electrodes on a print receiving material on which printing is to be performed, such as a substrate and a semiconductor package, using a paste or a fused metal. In addition, a method of forming the wiring pattern and the bumps such as bump electrodes on the printing substrate, using the intaglio printing method, a method for forming a wiring pattern, an apparatus for carrying out the method of forming the wiring pattern, the bump electrode and the wiring pattern are proposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.