Method of an apparatus for sputtering
US6110328A · kind A · utility
4Cited by
9References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1996 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Dec 5, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/13439
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A sputtering method comprises applying a negative voltage intermittently in a constant periodic cycle to a cathode disposed in a vacuum chamber, wherein the negative voltage is intermittently applied so that a time during which the negative voltage is not applied includes a time during which the voltage is controlled to be zero volt in a range of from 10 .mu.s to 10 ms, and the zero voltage time is equal to or longer than the time required by one arcing from its generation to extinction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.