Epoxy bond and stop etch fabrication method
US6110393A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 1998 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Apr 23, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A class of epoxy bond and stop etch (EBASE) microelectronic fabrication techniques is disclosed. The essence of such techniques is to grow circuit components on top of a stop etch layer grown on a first substrate. The first substrate and a host substrate are then bonded together so that the circuit components are attached to the host substrate by the bonding agent. The first substrate is then removed, e.g., by a chemical or physical etching process to which the stop etch layer is resistant. EBASE fabrication methods allow access to regions of a device structure which are usually blocked by the presence of a substrate, and are of particular utility in the fabrication of ultrafast electronic and optoelectronic devices and circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.