Article comprising molded circuit
US6110576A · kind A · utility
15Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 1998 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Oct 16, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31609
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An article comprising a molded circuit for providing a path for electrical current is disclosed. The molded circuit is formed of a first material layer and a second material layer. The first material layer is an electrically insulating material. The second material layer is an electrically conductive material. In an alternate embodiment, the second material layer is surrounded between two layers of the first material layer. The molded circuit can be formed using multi-material injection molding such as co-injection molding or two-shot injection molding. A printed circuit board can comprise the molded circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.