Method and apparatus for slurry polishing
US6110832A · kind A · utility
144Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1999 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Apr 28, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method and apparatus for Chemical-Mechanical Polishing of semiconductor wafers using various formulations of high viscosity slurry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.