Polymeric adhesive paste
US6111005A · kind A · utility
7Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1996 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Jan 30, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.