Duplex feedthrough and method therefor
US6111198A · kind A · utility
20Cited by
33References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 15, 1998 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Jun 15, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive feedthrough for providing electrical current to semiconductor packages. A conductive wall portion of a semiconductor package contains an insulating material disposed in an aperture in the conductive wall. The insulating material has an axial bore into which an electrical conductor is inserted. The conductor has a reduced diameter in the portion inside the axial bore and enlarged portions on either side of the axial bore.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.