Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
US6111306A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 6, 1997 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Oct 6, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53483
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, a holding substrate holding the semiconductor element, a frame body provided on the holding substrate so as to surround the semiconductor element and having a hole which communicates to a space formed between the holding substrate and the frame body and the frame body and the holding substrate form a housing, a plurality of leads having inner lead portions connected to the semiconductor element and outer lead portions extending outside the frame body, and a resin filling the space and encapsulating the semiconductor element and the inner lead portions. All of the outer lead portions extend outside the housing from one side of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.