Semiconductor device with leads engaged with notches
US6111312A · kind A · utility
21Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1999 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Jun 2, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided. This semiconductor device includes a resin package, a semiconductor chip, and leads consisting of inner leads and outer leads. The rear surface of the semiconductor chip and the inner leads are situated substantially on the same plane. The resin package is provided with notches on its mounting surface. The outer leads are bent inward along the exterior of the resin package and pulled around to the mounting surface, so that the edges of the outer leads are engaged with the notches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.