Reworkable thermoplastic encapsulant
US6111323A · kind A · utility
61Cited by
41References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1997 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Dec 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a thermoplastic polymer formed by ring opening polymerization of a cyclic oligomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.