Flexible cold plate having a one-piece coolant conduit and method employing same
US6111749A · kind A · utility
68Cited by
12References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1996 |
| Grant date | Aug 29, 2000 |
| Priority date | — |
| Expiry date | Sep 25, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for cooling electronic devices is suggested comprising of a thermally conductive, flexible, non-jointed cooling conduit able to house a coolant. The conduit is passed or pulled through apertures provided on two or more cold plates. The conduit and plates are then placed in thermal communication with the electronic device or assembly to be cooled. The flexibility of the conduit allows the conduit with plates to be rearranged as to conform to the contours of the device to be cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.