Method of forming thick film pattern and material for forming thick film pattern
US6113836A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1998 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Jun 22, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0568
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A female mold (2, 12, 22, 32, 42, 52, 62) having a desirable pattern is formed on a substrate (1, 11, 21, 31, 41, 51, 61). Next, ceramic material (3, 13, 23, 33, 43, 53, 63) is filled in spaces in the female mold. Thereafter, the female mold is removed by heating the entire substrate, whereby a desirable thick film pattern can be finely and easily formed. The inorganic paste material comprising inorganic liquid vehicle containing water glass as main ingredient and powdery solid dispersed in the inorganic liquid vehicle is used as the ceramic material. The volume change of the inorganic paste material is small during the drying and calcinating processes, thus the inorganic paste material is prevented from being broken.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.