Functionally graded metal substrates and process for making same
US6114048A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1998 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Sep 4, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12986
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional insert powder composition of loose powder metal is placed in a compact of a surrounding body powder composition and both metal compositions are sintered in a sintering furnace to form a sintered part. The sintered part is infiltrated in part or in whole with a molten metal compound to produce a functionally graded metal substrate having a density of at least 90% of theoretical. A heat-generating component such as a chip can be attached to the metal substrate for use in microelectronic packaging. When the functionally-graded metal substrate has two discrete compositions of copper/tungsten the surrounding body which has a CTE that ranges from about 5.6ppm/.degree. C. to about 7 ppm/.degree. C. constrains the expansion of the functional insert which has a thermal conductivity that ranges from about 200 W/mK to about 400 W/mK.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.