Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame
US6114192A · kind A · utility
20Cited by
14References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1998 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Jul 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.