Thermally conductive silicone composition
US6114429A · kind A · utility
28Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1998 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Sep 15, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermally conductive silicone composition which comprises (A) 5 to 30 weight % of a liquid silicone, (B) 50 to 94.98 weight % of at least one thickener selected from the group consisting of a zinc oxide powder, an aluminum powder, an aluminum nitride powder, a boron nitride powder and a silicon carbide powder, (C) 0.01 to 10 weight % of an organopolysiloxane having at least one per molecule of hydroxyl group attached directly to a silicon atom, and (D) 0.01 to 10 weight % of an alkoxysilane, thereby retainining satisfactory thermal conductive properties and hardly causing oil bleeding over a long time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.