Patent · US Expired

Continual flow rapid thermal processing apparatus and method

US6114662A · kind A · utility

5Cited by
10References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 5, 1997
Grant dateSep 5, 2000
Priority date
Expiry dateJun 5, 2017

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67745
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A rapid thermal processing apparatus and a method of using such apparatus for the continuous heat treatment of at least one workpiece, which apparatus includes a cavity of generally elongated shape, a process chamber defined by interior walls inside the cavity, a device for delivering, regulating and extracting process gases from the chamber, a device for transporting at least one workpiece through the chamber in a substantially forward direction, a device for heating at least a section of the chamber, and a device for cooling the at least one workpiece downstream from the heating device. The cavity for the apparatus may also be provided in either a curved or a linear configuration for carrying out the present invention method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.