Housing for optical integrated circuits
US6114673A · kind A · utility
8Cited by
27References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 1999 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | May 28, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A preferred embodiment of the housing incorporates an enclosure defining an interior cavity. A thermal bed is supported within the cavity and is configured to retain an optical integrated circuit within the cavity. First and second fiber members also are provided that each include a circuit end for engaging and optically communicating with the optical integrated circuit, and a coupling end for engaging a coupling. Preferably, the couplings are mounted to the enclosure so that an external fiber member can engage a coupling and optically communicate with the optical integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.