Multilayer circuit board with electrically resistive heating element
US6114674A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1997 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Oct 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/165
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit board and an associated heating apparatus is provided for heating electrical components. The multilayer circuit board includes a trace layer having at least one electrical trace terminating with a contact pad that is positioned to electrically contact a respective lead of an electrical component mounted upon the multilayer circuit board. The multilayer circuit board also includes a heating layer disposed in thermal contact with the electrical component mounted upon the multilayer circuit board. The heating layer includes a first electrically resistive heating element disposed upon an insulating substrate in general alignment with the electrical component mounted upon the multilayer circuit board. The electrically resistive heating element provides heat to maintain the operating temperature of the electrical component within a desired range. By increasing the operating temperature of the electrical component, the multilayer circuit board allows less expensive, commercial grade electronics to be utilized which would otherwise have been susceptible to failure at lower temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.