Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6117250A · kind A · utility
7Cited by
45References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1999 |
| Grant date | Sep 12, 2000 |
| Priority date | — |
| Expiry date | Feb 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Metal surfaces, particularly copper surfaces, which are oxidatively micro-etched to increase surface area, are provided acid-resistance by exposure to a thiazole compound and/or a thiocarbamide compound. The thiazole compound and/or thiocarbamide compound may be provided either in the oxidative micro-etching solution or provided in a post-micro-etching solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.