Patent · US Expired

Modulated molecularly bonded inherently conductive polymers on substrates with conjugated multiple lamellae and shaped articles thereof

US6117554A · kind A · utility

26Cited by
30References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 30, 1997
Grant dateSep 12, 2000
Priority date
Expiry dateMay 30, 2017

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31692
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Organic inherently conductive polymers, such as those based on polyaniline, polypyrrole and polythiophene, are sequentially formed in-situ onto polymeric surfaces that are chemically functionalized to molecularly bond the conductive polymers to the substrates. The polymeric substrate is preferably a preshaped or preformed thermoplastic film, fabric, or tube, although other forms of thermoplastic and thermoset polymers can be used as the substrates for functionalization using, most preferably, phosphonylation-based processes followed by exposure to an oxidatively polymerizable compound capable of forming an electrically conductive polymer. It has been found that the degree of electrical conductivity may be modulated by bonding further electrically conductive layers to the article. That is, each underlying conductive layer is functionalized prior to bonding of a subsequent conductive layer thereto until the degree of conductivity is achieved. In an alternative embodiment, metals such as gold or platinum may be bonded to one of the functionalized surfaces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.